ROUGHENED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED WIRING BOARD

A roughened copper foil (110) is provided that has a low roughness suitable for formation of a fine circuit and can provide a laminate with a surface profile that can achieve not only high etching properties of an electroless copper plating layer (115) and high resolution of a dry film (116) pattern but also high adhesion to a circuit when used in a semi-additive process (SAP). The roughened copper foil (110) of the present invention has at least one roughened surface. The roughened surface is provided with a plurality of primary roughening particles (12) each having a neck (12a). The primary roughening particles (12) have a plurality of secondary roughening particles (14) that are disposed on the entire surface including the neck (12a) and are smaller than the primary roughening particles (12). The density, calculated by division of the number of secondary protrusions on the neck (12a) by the surface area of the neck (12a), of the secondary roughening particles (14) is within a range of 9 to 30/?m2. The roughened surface has a ten-point average roughness Rz of 0.7 to 1.7 ?m. (Figure 3)