POLISHING COMPOSITION FOR MAGNETIC DISK SUBSTRATE, METHOD FOR PRODUCING MAGNETIC DISK SUBSTRATE, AND METHOD FOR POLISHING SAME

Provided is a magnetic disk substrate polishing composition capable of combining a high polishing rate and reduction of waviness with the use of a silica abrasive. This invention provides a magnetic disk substrate polishing composition comprising an abrasive that comprises silica particles, and wate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Taira OTSU, Noritaka YOKOMICHI, Yasushi MATSUNAMI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a magnetic disk substrate polishing composition capable of combining a high polishing rate and reduction of waviness with the use of a silica abrasive. This invention provides a magnetic disk substrate polishing composition comprising an abrasive that comprises silica particles, and water. The abrasive has a number average aspect ratio of 1.3 or lower. The abrasive has a ratio (A75/A50) of a cumulative 75th percentile aspect ratio (A75) to a cumulative 50th percentile aspect ratio (A50) of 1.05 or higher in its aspect ratio distribution by volume.