WAFER PROCESSING METHOD

A wafer processing method includes a polyolefin sheet (9) providing step of positioning a wafer (1) in an inside opening (7a) of a ring frame (7) and providing a polyolefin sheet (9) on a back side (1b) or a front side (1a) of the wafer (1) and on a back side (7c) of the ring frame (7), a uniting st...

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Bibliographische Detailangaben
Hauptverfasser:	Hayato KIUCHI, Yusuke FUJII, Emiko KAWAMURA, Yoshiaki YODO, Shigenori HARADA, Taro ARAKAWA, Makiko OHMAE, Masamitsu AGARI, Toshiki MIYAI, Minoru MATSUZAWA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A wafer processing method includes a polyolefin sheet (9) providing step of positioning a wafer (1) in an inside opening (7a) of a ring frame (7) and providing a polyolefin sheet (9) on a back side (1b) or a front side (1a) of the wafer (1) and on a back side (7c) of the ring frame (7), a uniting step of heating the polyolefin sheet (9) as applying a pressure to the polyolefin sheet (9) to thereby unite the wafer (1) and the ring frame (7) through the polyolefin sheet (9) by thermocompression bonding, a dividing step of applying a laser beam (16) to the wafer (1) to form modified layers (3a) in the wafer (1), thereby dividing the wafer (1) into individual device chips (1c), and a pickup step of picking up each device chip (1c) from the polyolefin sheet (9).