ELECTRICALLY CONDUCTIVE BONDING MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The present invention provides an electrically conductive bonding material having a high bonding strength and a high thermal conductivity, and capable of forming a bonding layer providing a very low porosity under low pressurization. The present invention relates to an electrically conductive bondin...

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Bibliographische Detailangaben
Hauptverfasser:	Takeshi KONDO, Shintaroh ABE, Teruki TANAKA, Rikia FURUSHO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASTING CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention provides an electrically conductive bonding material having a high bonding strength and a high thermal conductivity, and capable of forming a bonding layer providing a very low porosity under low pressurization. The present invention relates to an electrically conductive bonding material which bonds a chip and an adherend under pressure, the electrically conductive bonding material containing silver particles; silver compound particles; and a dispersant, wherein the silver particles and the silver compound particles are present in a weight ratio of 30:70 to 70:30, and the electrically conductive bonding material provide a porosity of 15% or less after the chip and the adherend are subject to pressurizing-bond under an air atmosphere of pressure of 10 MPa and 280?C for 5 minutes.