CURABLE RESIN FILM AND SHEET FOR FORMING A FIRST PROTECTIVE FILM

A curable resin film (12) is a film for forming a first protective film (12?) on a surface having a bump (91) of a semiconductor wafer (90) by being attached to the surface, and being cured, in which a visible light transmittance of the curable resin film before curing is 45% or less, and an infrare...

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Bibliographische Detailangaben
1. Verfasser:	YAMAGISHI, Masanori
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A curable resin film (12) is a film for forming a first protective film (12?) on a surface having a bump (91) of a semiconductor wafer (90) by being attached to the surface, and being cured, in which a visible light transmittance of the curable resin film before curing is 45% or less, and an infrared transmittance of the curable resin film before curing is 33% or more. A sheet for forming a first protective film includes a first supporting sheet (101, 102, 103), and the curable resin film on one surface of the first supporting sheet (101a, 102a, 103a). (Figure 2)