LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE

To provide a lead frame (100) including a pad (10), leads (12) arranged around the pad (10), and support bars (14) supporting the pad (10), wherein the support bars (14) and the leads (12) each have a rough surface (32) and a smooth surface (30), the smooth surface (30) of the support bar (14) on a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Takahiro ISHIBASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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