LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE

LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE

To provide a lead frame (100) including a pad (10), leads (12) arranged around the pad (10), and support bars (14) supporting the pad (10), wherein the support bars (14) and the leads (12) each have a rough surface (32) and a smooth surface (30), the smooth surface (30) of the support bar (14) on a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Takahiro ISHIBASHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:To provide a lead frame (100) including a pad (10), leads (12) arranged around the pad (10), and support bars (14) supporting the pad (10), wherein the support bars (14) and the leads (12) each have a rough surface (32) and a smooth surface (30), the smooth surface (30) of the support bar (14) on a side of one main face (100a) is closer to the pad (10) than the smooth surface (30) of the lead (12). (Fig. 1)