APPARATUS FOR DIVIDING WORKPIECE

A dividing apparatus (10) divides a workpiece (W) along projected dicing lines (L) into chips (C), the workpiece (W) being stuck to an upper surface of a protective tape (T) mounted on an annular frame (F). The dividing apparatus (10) includes a frame holding unit (11) for holding the annular frame...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Kazuki Kaneoka, Makoto Hirate, Chris Mihai, Takushi Takahara
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	A dividing apparatus (10) divides a workpiece (W) along projected dicing lines (L) into chips (C), the workpiece (W) being stuck to an upper surface of a protective tape (T) mounted on an annular frame (F). The dividing apparatus (10) includes a frame holding unit (11) for holding the annular frame (F) and a dividing unit (12) for pressing the workpiece (W) in the vicinity of one at a time of the projected dicing lines (L) and dividing the workpiece (W) into chips (C) along the projected dicing line (L). The dividing unit (12) includes a holder (20) for holding a portion of the workpiece (W) in the vicinity of the projected dicing line (L) where the workpiece (W) is to be broken, from both upper and lower surfaces of the workpiece (W), and a presser (21) for pressing chips (C) next to chips (C) held by the holder (20) across the projected dicing line (L) where the workpiece (W) is to be broken, thereby to divide the workpiece (W) along the projected dicing line (L).