INTEGRATED CIRCUIT DIE TRANSPORT APPARATUS AND METHODS
Die transport apparatus (100) and methods are disclosed herein. In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from th...
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| creator | ZHAO, Luyin XU, Dingying YIN, Wen |
| description | Die transport apparatus (100) and methods are disclosed herein. In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from the die contact surfaces (124). Other embodiments may be disclosed and/or claimed. |
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In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from the die contact surfaces (124). Other embodiments may be disclosed and/or claimed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS ; PACKING ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; STORING ; TRANSPORTING ; UNPACKING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220413&DB=EPODOC&CC=MY&NR=190303A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220413&DB=EPODOC&CC=MY&NR=190303A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO, Luyin</creatorcontrib><creatorcontrib>XU, Dingying</creatorcontrib><creatorcontrib>YIN, Wen</creatorcontrib><title>INTEGRATED CIRCUIT DIE TRANSPORT APPARATUS AND METHODS</title><description>Die transport apparatus (100) and methods are disclosed herein. In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from the die contact surfaces (124). 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In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from the die contact surfaces (124). Other embodiments may be disclosed and/or claimed.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING UNPACKING |
| title | INTEGRATED CIRCUIT DIE TRANSPORT APPARATUS AND METHODS |
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