INTEGRATED CIRCUIT DIE TRANSPORT APPARATUS AND METHODS

INTEGRATED CIRCUIT DIE TRANSPORT APPARATUS AND METHODS

Die transport apparatus (100) and methods are disclosed herein. In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHAO, Luyin, XU, Dingying, YIN, Wen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS
PACKING
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
STORING
TRANSPORTING
UNPACKING
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Beschreibung
Zusammenfassung:Die transport apparatus (100) and methods are disclosed herein. In some embodiments, a die transport apparatus (100) may include: a plurality of regularly arranged adhesive areas (102), wherein individual adhesive areas (102) have a die contact surface (124); and a relief area (104) recessed from the die contact surfaces (124). Other embodiments may be disclosed and/or claimed.