BONDING MATERIAL AND BONDING METHOD USING SAME

There are provided a bonding material, which can prevent voids from being generated in a silver bonding layer by preventing the entrainment of bubbles during the formation of a coating film even if the coating film is thickened, and a bonding method using the same. The bonding material of a silver p...

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Bibliographische Detailangaben
Hauptverfasser:	Tatsuro HORI, Satoru KURITA, Hiromasa MIYOSHI, Keiichi ENDOH
Format:	Patent
Sprache:	eng
Schlagworte:	CASTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY PERFORMING OPERATIONS POWDER METALLURGY SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	There are provided a bonding material, which can prevent voids from being generated in a silver bonding layer by preventing the entrainment of bubbles during the formation of a coating film even if the coating film is thickened, and a bonding method using the same. The bonding material of a silver paste includes fine silver particles, a solvent and an addition agent, wherein the solvent contains a first solvent of a diol, such as octanediol, and a second solvent which is a polar solvent ( preferably one or more selected from the group consisting of dibutyl diglycol, hexyl diglycol, decanol and dodecanol) having a lower surface tension than that of the first solvent and wherein the addition agent is a triol.