POLISHING PAD, METHOD FOR CONDITIONING POLISHING PAD,PAD-CONDITIONING AGENT AND USE THEREOF

A polishing pad with which micro waviness can be reduced is provided. The present invention provides a polishing pad that has been subjected to a conditioning process that uses a pad-conditioning agent. The polishing pad has a surface that shows an arithmetic mean roughness Ra by a non-contact metho...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TOMOHIDE KAMIYA, KAZUMASA SATO, NORITAKA YOKOMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing pad with which micro waviness can be reduced is provided. The present invention provides a polishing pad that has been subjected to a conditioning process that uses a pad-conditioning agent. The polishing pad has a surface that shows an arithmetic mean roughness Ra by a non-contact method of 3.0 ?m or less.