CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, AND USE OF CURABLE COMPOSITION

The invention is a curable composition comprising the following component (A), component (B) and component (C), Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1) R1 Si O 3/2 (a-1) Component (B): a particulate having an av...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAYAMA Hidekazu, KASHIO Mikihiro
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention is a curable composition comprising the following component (A), component (B) and component (C), Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1) R1 Si O 3/2 (a-1) Component (B): a particulate having an average primary particle diameter of 5 to 40 nm Component (C): a particulate having an average primary particle diameter of larger than 0.04 um to 8 um, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material. One aspect of the curable composition according to the invention can provide a cured product excellent in adhesiveness, peeling resistance and heat resistance, and a curable composition excellent in workability in coating process.