ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME
There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substr...
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| creator | SUGIYAMA Jirou MIHARA Naoaki KIRIKAE Noriyuki |
| description | There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element- supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250?C under a nitrogen atmosphere of less than 1%. (Fig. 1) |
| format | Patent |
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The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250?C under a nitrogen atmosphere of less than 1%. (Fig. 1)</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220124&DB=EPODOC&CC=MY&NR=189071A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220124&DB=EPODOC&CC=MY&NR=189071A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIYAMA Jirou</creatorcontrib><creatorcontrib>MIHARA Naoaki</creatorcontrib><creatorcontrib>KIRIKAE Noriyuki</creatorcontrib><title>ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME</title><description>There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element- supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250?C under a nitrogen atmosphere of less than 1%. (Fig. 1)</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhw9XF1DgnydHb08YlUcPb3cwl1DvEMc1VwdPFwDQYx3Dx9fBUc_VwUXDydPf3cdV08XRWcgOqAbIhcaDCIGeLhqhDs6OvKw8CalphTnMoLpbkZ5NxcQ5w9dFML8uNTiwsSk1PzUkvifSMNLSwNzA0djQkqAAA7wy2H</recordid><startdate>20220124</startdate><enddate>20220124</enddate><creator>SUGIYAMA Jirou</creator><creator>MIHARA Naoaki</creator><creator>KIRIKAE Noriyuki</creator><scope>EVB</scope></search><sort><creationdate>20220124</creationdate><title>ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME</title><author>SUGIYAMA Jirou ; MIHARA Naoaki ; KIRIKAE Noriyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY189071A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIYAMA Jirou</creatorcontrib><creatorcontrib>MIHARA Naoaki</creatorcontrib><creatorcontrib>KIRIKAE Noriyuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIYAMA Jirou</au><au>MIHARA Naoaki</au><au>KIRIKAE Noriyuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME</title><date>2022-01-24</date><risdate>2022</risdate><abstract>There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element- supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250?C under a nitrogen atmosphere of less than 1%. (Fig. 1)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME |
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