ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM USING THE SAME

There is provided an electrically conductive adhesive film which can be suitably used as an electrically conductive bonding material for bonding a semiconductor chip (particularly a power device) onto an element-supporting part of a lead frame or onto a circuit electrode part of an insulating substrate, for example, and which is capable of forming, between the semiconductor chip and the element- supporting part of a lead frame or the circuit electrode part of an insulating substrate, a bonding layer that excels both in heat resistance after bonding and sintering and in mounting reliability while being lead-free, and a dicing-die bonding film using the same. The electrically conductive adhesive film of the present invention comprises a metal particle (P), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250?C under a nitrogen atmosphere of less than 1%. (Fig. 1)