SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube (400) in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material (224) may include a cleaning pad la...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUMPHREY, BRET A, SHIVLAL, JANAKRAJ, SMITH, WAYNE C, HUMPHREY, ALAN E
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube (400) in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material (224) may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics. (Fig. 10A)