POLISHING COMPOSITION AND METHOD FOR PRODUCING MAGNETIC DISK SUBSTRATE

Provided is a polishing composition that allows achieving both a high polishing rate and waviness reduction. A polishing composition that is used for polishing a magnetic disk substrate and contains an abrasive is provided by the present invention. A difference between a pore diameter PV90 corresponding to a cumulative 90% diameter and a pore diameter PV10 corresponding to a cumulative 10% diameter, from a small diameter side, in a volume-based pore size distribution of the abrasive, lies in the range of 50 ? to 760 ?, and a specific surface area-based particle diameter of the abrasive according to a BET method lies in the range of 35 nm to 100 nm.