SURFACE-TREATED COPPER FOIL, LAMINATE USING SAME, COPPER FOIL, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

[Problem to be Solved] Provided is a surface- treated copper foil, and a laminate using the same, which has good adhesion with a resin and excellent resin transparency after removal of the copper foil by etching. [Solution) A surface-treated copper foil, wherein roughened particles are formed by a roughening treatment on one and/or both copper foil surfaces, a ten point average roughness ?z of the roughened surface in a TD measured by a contact roughness meter is 0.20 to 0 .80 ?m, a 60? gloss in an MD of the roughened surface is 76 to 350%, a ratio A/B between a surface area A of the roughened particles and an area B obtained when the roughened particles are viewed in a plane from the copper foil surface side is 1.90 to 2.40, the roughened surface includes any one or more elements selected from the group consisting of Ni and Co, if the roughened surface includes Ni, an amount of Ni deposited is 1,400 ?g/dm? or less, and if the roughened surface includes Co, an amount of Co deposited is 2,400 ?g/dm? or less.