POLISHING COMPOSITION
To provide a polishing composition capable of achieving a high polishing rate and a surface accuracy of a surface to be polished sufficient in practice, by using silica abrasives. The polishing composition disclosed here includes abrasives, an acid, and water. The abrasives include silica abrasives...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | To provide a polishing composition capable of achieving a high polishing rate and a surface accuracy of a surface to be polished sufficient in practice, by using silica abrasives. The polishing composition disclosed here includes abrasives, an acid, and water. The abrasives include silica abrasives A that are other than colloidal silica and have a specific surface area of 2 m2/g or more and 60 m2/g or less and an average particle diameter of 50 nm or more and 15,000 nm or less. |
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