COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermedia...

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Bibliographische Detailangaben
Hauptverfasser: ISHII, Masafumi, Yoshiyuki MIYOSHI, KOHIKI, Michiya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601- 1994, the ten point average roughness Rz of the surface is 6.0 ?m or less. (Figure 1)