FLUX FOR SOLDER PASTE AND SOLDER PASTE
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass%. The flux also contain...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass%. The flux also contains 0-20 mass% of a block organic acid and 0-3 mass% of an activator. |
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