DIES PREPEELING APPARATUS AND METHOD

An apparatus and a method for prepeeling semiconductor dies from a dicing tape with the semiconductor dies attached thereon are disclosed. The apparatus comprises a chamber having a bottom base, a top opening and an annular sidewall extended upward from the periphery of the base. The side wall has a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hem TAKIAR, Jidong ZHANG, Nadeer ELIPARAKKAL, Zhong LU, Ning LIU, Enyong TAI, Chin Tien CHIU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus and a method for prepeeling semiconductor dies from a dicing tape with the semiconductor dies attached thereon are disclosed. The apparatus comprises a chamber having a bottom base, a top opening and an annular sidewall extended upward from the periphery of the base. The side wall has a substantially flat top surface. The apparatus further comprises a cover disposed above the chamber. The cover has a central opening. The apparatus further comprises at least one inlet disposed in the base and a pressure regulator connected to the chamber via the at least one inlet. The dicing tape is disposed between the cover and the top surface of the sidewall to hermetically seal the top opening of the chamber. The semiconductor dies are located directly above the top opening of the chamber.