METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER
Described is an apparatus which comprises: a backside of a first die (301) having a redistribution layer, RDL, (211); one or more passive planar devices (213, 214) disposed on the backside, the one or more passive planar devices (213, 214) formed in the RDL (211); a front-side of the first die (301)...
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creator | GOLDMAN, Richard J COWLEY, Nicholas P LEE, Kevin J SARASWAT, Ruchir ZILLMANN, Uwe |
description | Described is an apparatus which comprises: a backside of a first die (301) having a redistribution layer, RDL, (211); one or more passive planar devices (213, 214) disposed on the backside, the one or more passive planar devices (213, 214) formed in the RDL (211); a front-side of the first die (301) having an active region; and one or more vias (205) to couple the active region with the one or more passive planar devices (213, 214). (Figure 2) |
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(Figure 2)</abstract><oa>free_for_read</oa></addata></record> |
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title | METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER |
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