METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER

METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER

Described is an apparatus which comprises: a backside of a first die (301) having a redistribution layer, RDL, (211); one or more passive planar devices (213, 214) disposed on the backside, the one or more passive planar devices (213, 214) formed in the RDL (211); a front-side of the first die (301)...

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Bibliographische Detailangaben
Hauptverfasser: GOLDMAN, Richard J, COWLEY, Nicholas P, LEE, Kevin J, SARASWAT, Ruchir, ZILLMANN, Uwe
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Described is an apparatus which comprises: a backside of a first die (301) having a redistribution layer, RDL, (211); one or more passive planar devices (213, 214) disposed on the backside, the one or more passive planar devices (213, 214) formed in the RDL (211); a front-side of the first die (301) having an active region; and one or more vias (205) to couple the active region with the one or more passive planar devices (213, 214). (Figure 2)