ULTRA-THIN COPPER FOIL WITH CARRIER, MANUFACTURING METHOD THEREFOR, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

Provided is an extremely thin copper foil with a carrier which can achieve the compatibility between laser drillability and microcircuit formability in the processing of a copper-clad laminate or the production of a printed wiring board. The extremely thin copper foil with a carrier of the present invention includes a carrier foil, a release layer, and an extremely thin copper foil disposed in this order. The surface of the extremely thin copper foil on the side adjacent to the release layer has an average distance between surface peaks (peak spacing) of 2.5 to 20.0 ?m and a level difference in a core part (core roughness depth) Rk of 1.5 to 3.0 ?m. the surface of the extremely thin copper foil on the side away from the release layer has a maximum height difference of waviness (Wmax) of 4.0 ?m or less.