COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING

Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad (200) having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad (202) with a first surface having a first pressure sensitive adhesive layer (204) coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.