GUIDE VANE AND JETTING APPARATUS

A guide vane (10) has a devised guide configuration for changing a flow direction of molten solder. The guide vane (10) comprises a half-cylindrical plate ( 11) having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid;...

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Bibliographische Detailangaben
1. Verfasser:	NISHIDA SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A guide vane (10) has a devised guide configuration for changing a flow direction of molten solder. The guide vane (10) comprises a half-cylindrical plate ( 11) having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid; and a half-cylindrical plate ( 12) having a prescribed inner surface shape and a prescribed height, being stood on the board (13) on which the first member ( 11) is stood and changing the flow direction of the fluid as shown in FIG. 1. The half-cylindrical plate (11) and the half-cylindrical plate ( 12) are faced so that an inner surface of the half-cylindrical plate ( 11) is faced to an edge of the half-cylindrical plate (12) and an inner surface of the half cylindrical plate (12) is faced to an edge of the halfcylindrical plate (11 ). This structure allows to jet the molten solder to a target place and unifomtize a widthwise distribution of the jetting height of the molten solder.