COPPER FOIL, COPPER FOIL WITH CARRIER FOIL, AND COPPER-CLAD LAMINATE

An object of the present disclosure is to provide a copper foil that has excellent adhesion to an insulating resin substrate compared with an unroughened copper foil and favorable etchability equivalent to that of the unroughened copper foil. In order to accomplish the object of the present disclosure, a copper foil is employed. The copper foil is characterized in that the copper foil includes a roughened layer on at least one surface thereof, wherein the roughened layer has a fine concave-convex structure being formed of needle-like or plate-like convex sections including a copper composite compound and having a size smaller than or equal to 500 nm; and wherein a silane coupling agent treatment layer is formed on a surface of the roughened layer. Alternatively, a copper foil with a carrier foil is employed. The copper foil with a carrier foil is characterized in that the copper foil with a carrier foil has a layer structure of carrier foil/binding interface layer/copper foil layer, wherein a roughened layer that has a fine concave-convex structure being formed of needle-like or plate-like convex sections including a copper composite compound and having a size smaller than or equal to 500 nm is provided on a surface of the copper foil layer; and wherein a silane coupling agent treatment layer is formed on a surface of the roughened layer.