SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate (22, 100, 301, 363, 349, 405, 504, 721, 610). The premolded substrate can have a semiconductor die (25, 112, 310, 328, 346, 408(a)-(c), 710, 602, 606) attached to it, and an encapsulating...

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Hauptverfasser: JOSHI, RAJEEV, D, LEE BUYONG-OK, KENG, TAN TEIK, WU, CHUNG-LIN, CHOI, YOONHWA, GOOI, BOON HUAN, LIM, LAY YEAP, IYER, VENKAT, NAM, SHIBACK, CHONG, DAVID, JEON , OSEOB, ESTACIO, MARIA CRISTINA B
Format: Patent
Sprache:eng
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Zusammenfassung:Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate (22, 100, 301, 363, 349, 405, 504, 721, 610). The premolded substrate can have a semiconductor die (25, 112, 310, 328, 346, 408(a)-(c), 710, 602, 606) attached to it, and an encapsulating material may be disposed over the semiconductor die.