PRESSURE-SENSITIVE ADHESIVE TAPE FOR SEMICONDUCTOR SUBSTRATE FABRICATION

A pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication of the present invention includes a base material (4) and a pressure-sensitive adhesive layer (2) laminated on one surface of the base material (4), in which the base material (4) has a notched layer (41) positioned on the one surface side and an expansion layer (42) laminated on the other surface of the notched layer (41) , and the expansion layer (42) has a tack strength equal to or higher than (1) kPa and equal to or lower than (200) kPa at 80?C. In a case where the above constitution is adopted, it is possible to provide a pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication that makes it possible to reliably prevent the occurrence of warpage in a dicing step and to inhibit or prevent the expansion layer (42) from being fused with a dicing table. (Figure 3)