PHOTOSENSITIVE RESIN COMPOSITION

[Problem] A photosensitive resin composition forming a resist pattern with high resolution and an excellent bottom shape, as well as a method of forming the resist pattern and a method of producing a circuit board using the photosensitive resin composition are provided. [Solution] A photosensitive r...

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Bibliographische Detailangaben
1. Verfasser: Shinichi Kunimatsu
Format: Patent
Sprache:eng
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Zusammenfassung:[Problem] A photosensitive resin composition forming a resist pattern with high resolution and an excellent bottom shape, as well as a method of forming the resist pattern and a method of producing a circuit board using the photosensitive resin composition are provided. [Solution] A photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound including an ethylenically unsaturated bond, and (C) a photopolymerization initiator; component (A) includes a copolymer in which the copolymerization ratio of a comonomer containing an aromatic group is not less than 20% by mass; component (B) includes a compound containing an aromatic ring, an alkylene oxide chain and an ethylenically unsaturated bond; and the content of propylene oxide units in the alkylene oxide chain is more than 50% by mole.