COPPER FOIL EXCELLENT IN ADHERENCE WITH RESIN, METHOD FOR MANUFACTURING THE COPPER FOIL, AND PRINTED WIRING BOARD OR BATTERY NEGATIVE ELECTRODE MATERIAL USING THE ELECTROLYTIC COPPER FOIL
An electrolytic copper foil is prepared by forming roughening particles on the mat surface (M surface) of an electrolytic copper foil, and the ?average particle size of the roughening particles is 0.1 to 1.0 ?m. An electrolytic copper foil in which the adhesive strength of the copper foil with a res...
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| Format: | Patent |
| Sprache: | eng |
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