COPPER FOIL EXCELLENT IN ADHERENCE WITH RESIN, METHOD FOR MANUFACTURING THE COPPER FOIL, AND PRINTED WIRING BOARD OR BATTERY NEGATIVE ELECTRODE MATERIAL USING THE ELECTROLYTIC COPPER FOIL

An electrolytic copper foil is prepared by forming roughening particles on the mat surface (M surface) of an electrolytic copper foil, and the ?average particle size of the roughening particles is 0.1 to 1.0 ?m. An electrolytic copper foil in which the adhesive strength of the copper foil with a resin base material can be raised by improving a roughening..:treated layer on the copper foil without deteriorating various properties of the electrolytic copper foil, and a higher peel strength can be provided particularly when the copper foil is used in combination with semiconductor package base materials and liquid crystal polymer base materials, which usually have a low adhesive force with copper foils as compared to general-purpose epoxy resin-based base materials (FR-4 and and the like), and a method for manufacturing the electrolytic copper foil are provided. An object of the present invention is to provide an electrolytic copper foil which is useful as an electrolytic copper foil used for printed wiring boards or battery (LiB and the like) negative electrode materials. Figure 1