INTEGRATED CIRCUIT MANUFACTURE USING DIRECT WRITE LITHOGRAPHY

Integrated circuits (2) are manufactured using a direct write lithography step to at least partially form at least one layer within the integrated circuit (2). The performance characteristics of an at least partially formed integrated circuit (2) are measured and then the layout design to be applied with a direct write lithography step is varied in dependence upon those performance characteristics. Accordingly, the performance of an individual integrated circuit (2), wafer of integrated circuits (2) or batch of wafers may be altered.