METHOD, APPARATUS AND SYSTEM FOR SINGLE-ENDED COMMUNICATION OF TRANSACTION LAYER PACKETS

Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit, IC, chip (852) includes a protocol stack comprising a transaction layer (860) which performs operations compatible with a Peripheral C...

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Bibliographische Detailangaben
Hauptverfasser:	SPRY, Bryan L, LIM, Su Wei, VERMA, Rohit R, LEDDIGE, Michael W, LOOI, Lily P, HUNSAKER, MIKAL, LIEW, Vui Yong, SWARTZ, Ronald W
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Beschreibung
Zusammenfassung:	Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit, IC, chip (852) includes a protocol stack comprising a transaction layer (860) which performs operations compatible with a Peripheral Component Interconnect Expressa??, PCiea??, specification. Transaction layer packets, exchanged between the transaction layer (860) and a link layer (862) of the protocol stack, are compatible with a PCiea?? format. In another embodiment, a physical layer (864) of the protocol stack is to couple the IC chip (852) to another IC chip (870) for an exchange of the transaction layer packets via single-ended communications. A packaged device (850) includes both of the IC chips (852, 870).