ELECTRO-DEPOSITED COPPER FOIL, METHOD OF MANUFACTURING ELECTRO-DEPOSITED COPPER FOIL, AND SURFACE-TREATED COPPER FOIL MANUFACTURED BY USING ELECTRO-DEPOSITED COPPER FOIL

An object of the present invention is to provide an electro-deposited copper foil far excellent in physical properties after heating at high-temperature than the conventional- electro-deposited copper foils and is suitable for usage as a negative electrode current collector of a lithium ion secondar...

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Bibliographische Detailangaben
Hauptverfasser: TOMONAGA, SAKIKO, MIYAKE, KOICHI, NAKAHARA, HIROAKI, SHIBATA, YASUHIRO, HOZUMI, KAZUTAKA
Format: Patent
Sprache:eng
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Zusammenfassung:An object of the present invention is to provide an electro-deposited copper foil far excellent in physical properties after heating at high-temperature than the conventional- electro-deposited copper foils and is suitable for usage as a negative electrode current collector of a lithium ion secondary battery. An electro-deposited copper foil- having tensile strength as received of 600 MPa or more and tensile strength after heating at 350 deg.-C for t hour of 410 MPa or more is employed to achieve the object. Moreover, a sulfuric acid based copper electrolytic solution containing polyethyleneimine having a molecular weight of 10000 to 70000 in concentration of 20 mg/L to 100 mq/l and a chloride ion in concentration of 0.5 mg/l, to 2.5 mg/L is used in a method of manufacturing the electrodeposited copper foil.