USE OF SELECTIVE WEE TO OBTAIN NEAR PLANAR TOPOGRAPHY
A method for removing photoresist using Wafer Edge Exclusion (WEE) from the water coding area is disclosed herein. WEE is used at metal-1 layer and metal-2 layers in order to reduce the topographical defects around the water coding area. Figure 2
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method for removing photoresist using Wafer Edge Exclusion (WEE) from the water coding area is disclosed herein. WEE is used at metal-1 layer and metal-2 layers in order to reduce the topographical defects around the water coding area. Figure 2 |
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