BOARD-EDGE INTERCONNECTION MODULE WITH INTEGRATED CAPACITIVE COUPLING FOR ENABLING ULTRA-MOBILE COMPUTING DEVICES

A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wi...

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Bibliographische Detailangaben
Hauptverfasser:	MIN KEEN TANG, SU SIN FLORENCE PHUN, KHANG CHOONG YONG, JACKSON CHUNG PENG KONG, ENG HUAT GOH, BOK ENG CHEAH
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.