CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION

The present invention is: a curable composition comprising a component (A) and a component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:40, the component (A) being a silane compound copolymer that is represented by a formula ( a-1 ), and has a weight average molecular weight o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KASHIO, Mikihiro, MATSUI, Masami
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention is: a curable composition comprising a component (A) and a component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:40, the component (A) being a silane compound copolymer that is represented by a formula ( a-1 ), and has a weight average molecular weight of 800 to 30,000, ... ~-1) wherein R1 is a hydrogen atom, etc., X 0 is a halogen atom, etc., Dis a single bond, etc., R2 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, etc., Z is a hydroxyl group, etc., m and n are independently a positive integer, and o, p, q, and rare independently 0 or a positive integer, and the component (B) being a silane coupling agent that includes a nitrogen atom in its molecule. With the invention, it is possible to provide: a curable composition that produces a cured product that exhibits excellent heat resistance, excellent transparency, and high adhesion; a cured product obtained by curing the curable composition; and a method for using the curable composition as an optical device adhesive, etc.