A POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANINGB COMPOSITION COMPRISING A SPECIFIC SULFUR-CONTAINING COMPOUND AND A SUGAR ALCOHOL OR A POLYCARBOXYCLIC ACID

A POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANINGB COMPOSITION COMPRISING A SPECIFIC SULFUR-CONTAINING COMPOUND AND A SUGAR ALCOHOL OR A POLYCARBOXYCLIC ACID

A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (?SH), thioether (?SR1 )or thiocarbonyl (>C=S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least...

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Bibliographische Detailangaben
Hauptverfasser: LI, Yuzhuo, VENKATARAMAN, SHYAM SUNDAR, ZHONG, MINGJIE
Format: Patent
Sprache:eng
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Zusammenfassung:A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (?SH), thioether (?SR1 )or thiocarbonyl (>C=S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least three hydroxyl (?OH) groups and does not comprise any carboxylic acid (?COOH) or carboxylate (?COO -) groups, and (C)an aqueous medium. (No suitable figure)