A METHOD OF DEPOSITING AN OBJECT ONTO WIRING BOARD AND A SYSTEM USING THE SAME

A METHOD OF DEPOSITING AN OBJECT ONTO WIRING BOARD AND A SYSTEM USING THE SAME A method of depositing one or more stiffener onto a wiring board comprises the steps of engaging the wiring board onto a heat-retaining pallet to form an assembly; pre-heating the assembly to a temperature ranged from 70...

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1. Verfasser: Tew Hai San
Format: Patent
Sprache:eng
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Zusammenfassung:A METHOD OF DEPOSITING AN OBJECT ONTO WIRING BOARD AND A SYSTEM USING THE SAME A method of depositing one or more stiffener onto a wiring board comprises the steps of engaging the wiring board onto a heat-retaining pallet to form an assembly; pre-heating the assembly to a temperature ranged from 70 to 1400C; and disposing the stiffeners onto the pre-heated wiring board of the assembly, wherein the pallet of the assembly retains sufficient heat for the wiring board to at least partially melt the stiffener, more preferably adhesive stiffener, to fix onto the wiring board upon disposition of the stiffeners. (Most illustrated by figure 1)