COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR

FIRST, A HORIZONTAL NOZZLE (23) IS INSERTED BETWEEN AN UPPER MOLD SECTION (6) AND A LOWER MOLD SECTION (7) IN A HORIZONTALLY EXTENDING STATE. THEN, LIQUID RESIN (4) IS HORIZONTALLY DISCHARGED FROM A DISCHARGE PORT (29) OF THE HORIZONTAL NOZZLE (23). THUS, THE LIQUID RESIN (4) IS SUPPLIED INTO A CAVI...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMADA, TETSUYA, GOTOH, TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEWING GUM COCOA COCOA PRODUCTS, e.g. CHOCOLATE CONFECTIONERY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOODS OR FOODSTUFFS HUMAN NECESSITIES ICE-CREAM INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS PREPARATION THEREOF SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SUBSTITUTES FOR COCOA OR COCOA PRODUCTS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	FIRST, A HORIZONTAL NOZZLE (23) IS INSERTED BETWEEN AN UPPER MOLD SECTION (6) AND A LOWER MOLD SECTION (7) IN A HORIZONTALLY EXTENDING STATE. THEN, LIQUID RESIN (4) IS HORIZONTALLY DISCHARGED FROM A DISCHARGE PORT (29) OF THE HORIZONTAL NOZZLE (23). THUS, THE LIQUID RESIN (4) IS SUPPLIED INTO A CAVITY (10). THEREAFTER THE UPPER MOLD SECTION (6) AND THE LOWER MOLD SECTION (7) ARE CLOSED. CONSEQUENTLY, AN ELECTRONIC COMPONENT (2) MOUNTED ON A SUBSTRATE (1) IS DIPPED IN THE LIQUID RESIN (4) STORED IN THE CAVITY (10). THEREFORE, THE ELECTRONIC COMPONENT (2) IS RESIN-SEALED ON THE SUBSTRATE (1) BY COMPRESSION MOLDING.