DEVICE AND METHOD FOR SEPARATING ELECTRONIC COMPONENTS

THE INVENTION RELATES TO A METHOD FOR SEPARATING ELECTRONIC COMPONENTS (110), COMPRISING THE PROCESSING STEPS OF PLACING AN ASSEMBLY OF ELECTRONIC COMPONENTS (110) ON A MANIPULATOR (7), TRANSPORTING THE ELECTRONIC COMPONENTS (110) WITH THE MANIPULATOR (7) ALONG A FIRST CUTTING TOOT SUCH THAT THE ASS...

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Hauptverfasser: IN 'T VELD, FREDERIK HENDRIK, ZIJL, JOANNES LEONARDUS JURRIAN, WENSINK, HENDRIK
Format: Patent
Sprache:eng
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Zusammenfassung:THE INVENTION RELATES TO A METHOD FOR SEPARATING ELECTRONIC COMPONENTS (110), COMPRISING THE PROCESSING STEPS OF PLACING AN ASSEMBLY OF ELECTRONIC COMPONENTS (110) ON A MANIPULATOR (7), TRANSPORTING THE ELECTRONIC COMPONENTS (110) WITH THE MANIPULATOR (7) ALONG A FIRST CUTTING TOOT SUCH THAT THE ASSEMBLY IS CUT THROUGH ONLY PARTIALLY ALONG CUTTING LINES IN THE THICKNESS DIRECTION THEREOF, AND TRANSPORTING THE PARTIALLY SEVERED ASSEMBLY (100) WITH A MANIPULATOR (7) ALONG A SECOND CUTTING TOOL SUCH THAT THE CUTTING LINES ARE SEVERED ALMOST COMPLETELY. THE INVENTION ALSO RELATES TO A DEVICE FOR SEPARATING ELECTRONIC COMPONENTS (110), AND TO A SEPARATED ELECTRONIC COMPONENT OBTAINABLE WITH THE METHOD. THE MOST ILLUSTRATIVE DRAWING IS