DEVICE AND METHOD FOR SEPARATING ELECTRONIC COMPONENTS
THE INVENTION RELATES TO A METHOD FOR SEPARATING ELECTRONIC COMPONENTS (110), COMPRISING THE PROCESSING STEPS OF PLACING AN ASSEMBLY OF ELECTRONIC COMPONENTS (110) ON A MANIPULATOR (7), TRANSPORTING THE ELECTRONIC COMPONENTS (110) WITH THE MANIPULATOR (7) ALONG A FIRST CUTTING TOOT SUCH THAT THE ASS...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | THE INVENTION RELATES TO A METHOD FOR SEPARATING ELECTRONIC COMPONENTS (110), COMPRISING THE PROCESSING STEPS OF PLACING AN ASSEMBLY OF ELECTRONIC COMPONENTS (110) ON A MANIPULATOR (7), TRANSPORTING THE ELECTRONIC COMPONENTS (110) WITH THE MANIPULATOR (7) ALONG A FIRST CUTTING TOOT SUCH THAT THE ASSEMBLY IS CUT THROUGH ONLY PARTIALLY ALONG CUTTING LINES IN THE THICKNESS DIRECTION THEREOF, AND TRANSPORTING THE PARTIALLY SEVERED ASSEMBLY (100) WITH A MANIPULATOR (7) ALONG A SECOND CUTTING TOOL SUCH THAT THE CUTTING LINES ARE SEVERED ALMOST COMPLETELY. THE INVENTION ALSO RELATES TO A DEVICE FOR SEPARATING ELECTRONIC COMPONENTS (110), AND TO A SEPARATED ELECTRONIC COMPONENT OBTAINABLE WITH THE METHOD. THE MOST ILLUSTRATIVE DRAWING IS |
---|