METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS, WHEREIN THE ENCAPSULATING MATERIAL IS COOLED

THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, WHEREIN A LIQUID ENCAPSULATING MATERIAL (9) COMPRISING POLYMER AFTER CURING IS COOLED IN FORCED MANNER. THE INVENTION FURTHER ALSO COMPRISES A MOULD PART (30) FOR APPLYING IN A DEVICE FOR ENCAPSULATING EL...

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Bibliographische Detailangaben
Hauptverfasser:	MERKENS, MARK, ALEXANDER, ZIJL, JOANNES, LEONARDUS JURRIAN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Zusammenfassung:	THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, WHEREIN A LIQUID ENCAPSULATING MATERIAL (9) COMPRISING POLYMER AFTER CURING IS COOLED IN FORCED MANNER. THE INVENTION FURTHER ALSO COMPRISES A MOULD PART (30) FOR APPLYING IN A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, AND SUCH A DEVICE.