A METHOD OF MANUFACTURING CHIP-ON-BOARD AND SURFACE MOUNT DEVICE LED SUBSTRATE

A METHOD OF MANUFACTURING CHIP-ON-BOARD LED SUBSTRATE (100) AND SURFACE MOUNT DEVICE LED SUBSTRATE (108) IS PROVIDED, CHARACTERIZED IN THAT, THE CHIP-ON-BOARD LED SUBSTRATE (100) AND SURFACE MOUNT DEVICE LED SUBSTRATE (108) INCLUDES A FINE-PATTERNED THICK FILM, THE METHOD INCLUDES THE STEPS OF FORMI...

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Bibliographische Detailangaben
Hauptverfasser:	VIVEGANANTHAN RAJANGAM, REMAKANTAN RAMACHANDRAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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