A METHOD OF MANUFACTURING CHIP-ON-BOARD AND SURFACE MOUNT DEVICE LED SUBSTRATE

A METHOD OF MANUFACTURING CHIP-ON-BOARD LED SUBSTRATE (100) AND SURFACE MOUNT DEVICE LED SUBSTRATE (108) IS PROVIDED, CHARACTERIZED IN THAT, THE CHIP-ON-BOARD LED SUBSTRATE (100) AND SURFACE MOUNT DEVICE LED SUBSTRATE (108) INCLUDES A FINE-PATTERNED THICK FILM, THE METHOD INCLUDES THE STEPS OF FORMING A GLASS BASED DIELECTRIC LAYER (103, 111) ON A METAL PLATE (101, 109), FIRING THE GLASS BASED DIELECTRIC LAYER (103, 111), APPLYING A METAL BASED CONDUCTOR (104, 113) OVER THE DIELECTRIC LAYER (103, 111), DRYING THE METAL BASED CONDUCTOR LAYER (104, 113), FIRING THE GLASS AND METAL LAYERS (103, 104, 111, 113) PRODUCING A THICK FILM AND POSITIONING LED DIE (105) INTO POCKETS BETWEEN CIRCUITS FOR CHIP-ON-BOARD APPLICATION AND SOLDERING PACKAGED LED (114) ONTO THE CIRCUIT, WHEREIN THE METHOD ALLOWS FOR CONSOLIDATION OF THICK FILM AND BONDING TO SUBSTRATE (100, 108); WHEREIN A THIN METAL PLATE (101, 109) IS USED AS A BARE SUBSTRATE WITH MULTIPLE PRINT-DRY-FIRE CYCLES TO FORM REQUIRED DIELECTRIC AND CONDUCTOR PATTERN TO MEET REQUIRED THICKNESS; AND SAID THIN METAL PLATE (101, 109) IS SELECTED FROM ALUMINIUM GRADES OF 3003 SERIES, 5052 SERIES OR 6001 SERIES. THE MOST ILLUSTRATIVE DRAWING: