LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING HIGH DENSITY CONTACTS

LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING HIGH DENSITY CONTACTS

A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical coupled to the IC ship. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portion of the electrical co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LI, TUNG LOK
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical coupled to the IC ship. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an encapsulation compound, with portion of the electrical contracts protruding from a bottom surface of the encapsulation.