LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE
THE PRESENT INVENTION PROVIDES AN LED (109) AND THE MANUFACTURING METHOD THEREOF, AND A LIGHT EMITTING DEVICE. THE LED (109) INCLUDES A FIRST ELECTRODE (102), FOR CONNECTING THE LED (109) TO A NEGATIVE TERMINAL OF A POWER SUPPLY; A SUBSTRATE (103), LOCATED ON THE FIRST ELECTRODE (102); AND AN LED CH...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | THE PRESENT INVENTION PROVIDES AN LED (109) AND THE MANUFACTURING METHOD THEREOF, AND A LIGHT EMITTING DEVICE. THE LED (109) INCLUDES A FIRST ELECTRODE (102), FOR CONNECTING THE LED (109) TO A NEGATIVE TERMINAL OF A POWER SUPPLY; A SUBSTRATE (103), LOCATED ON THE FIRST ELECTRODE (102); AND AN LED CHIP, LOCATED ON THE SUBSTRATE (103); IN WHICH A PLURALITY OF CONTACT HOLES ARE FORMED THROUGH THE SUBSTRATE (103), THE CONTACT HOLES ARE EVENLY DISTRIBUTED AND FILLED WITH ELECTRODE PLUGS CONNECTING THE FIRST ELECTRODE TO THE LED CHIP. THE LIGHT EMITTING DEVICE INCLUDES THE LED (109), AND FURTHER INCLUDES A BASE (101) AND AN LED (109) MOUNTED ON THE BASE (101). THE MANUFACTURING METHOD INCLUDES: PROVIDING A SUBSTRATE (201); FORMING ON THE SUBSTRATE (201) AN LED CHIP AND A SECOND ELECTRODE (210) SUCCESSIVELY; FORMING A PLURALITY OF EVENLY DISTRIBUTED CONTACT HOLES ON A BACKFACE OF THE SUBSTRATE (201), THE CONTACT HOLES EXTENDING THROUGH THE SUBSTRATE (201) AND TO THE LED CHIP; AND FILLING THE CONTACT HOLES WITH CONDUCTING MATERIAL TILL THE BACKFACE OF THE SUBSTRATE IS COVERED BY THE CONDUCTING MATERIAL. THE LED (109) HAS A HIGH LUMINOUS EFFICIENCY AND THE MANUFACTURING METHOD IS EASY TO IMPLEMENT. (FIG. 1) |
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