VAPOR DEPOSITION APPARATUS AND PROCESS FOR CONTINUOUS DEPOSITION OF A DOPED THIN FILM LAYER ON A SUBSTRATE

AN APPARATUS AND RELATED PROCESS ARE PROVIDED FOR VAPOR DEPOSITION OF A SUBLIMATED SOURCE MATERIAL AS A DOPED THIN FILM ON A PHOTOVOLTAIC (PV) MODULE SUBSTRATE. A RECEPTACLE IS DISPOSED WITHIN A VACUUM HEAD CHAMBER AND IS CONFIGURED FOR RECEIPT OF A SOURCE MATERIAL SUPPLIED FROM A FIRST FEED TUBE. A...

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Hauptverfasser:	FELDMAN-PEABODY, SCOTT DANIEL, PAVOL, MARK JEFFREY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	AN APPARATUS AND RELATED PROCESS ARE PROVIDED FOR VAPOR DEPOSITION OF A SUBLIMATED SOURCE MATERIAL AS A DOPED THIN FILM ON A PHOTOVOLTAIC (PV) MODULE SUBSTRATE. A RECEPTACLE IS DISPOSED WITHIN A VACUUM HEAD CHAMBER AND IS CONFIGURED FOR RECEIPT OF A SOURCE MATERIAL SUPPLIED FROM A FIRST FEED TUBE. A SECOND FEED TUBE CAN PROVIDE A DOPANT MATERIAL INTO THE DEPOSITION HEAD. A HEATED DISTRIBUTION MANIFOLD IS DISPOSED BELOW THE RECEPTACLE AND INCLUDES A PLURALITY OF PASSAGES DEFINED THERETHROUGH. THE RECEPTACLE IS INDIRECTLY HEATED BY THE DISTRIBUTION MANIFOLD TO A DEGREE SUFFICIENT TO SUBLIMATE SOURCE MATERIAL WITHIN THE RECEPTACLE. A DISTRIBUTION PLATE IS DISPOSED BELOW THE DISTRIBUTION MANIFOLD AND AT A DEFINED DISTANCE ABOVE A HORIZONTAL PLANE OF A SUBSTRATE CONVEYED THROUGH THE APPARATUS TO FURTHER DISTRIBUTE THE SUBLIMATED SOURCE MATERIAL PASSING THROUGH THE DISTRIBUTION MANIFOLD ONTO THE UPPER SURFACE OF THE UNDERLYING SUBSTRATE.