POLISHING LIQUID COMPOSITION

A POLISHING LIQUID COMPOSITION THAT MAKES IT POSSIBLE TO PROVIDE A POLISHED SUBSTRATE SURFACE ON WHICH SCRATCHES AND/OR WAVINESS ARE REDUCED, WITHOUT IMPAIRING PRODUCTIVITY, IS PROVIDED, AND FURTHER, A METHOD FOR MANUFACTURING AND POLISHING A SUBSTRATE USING THIS POLISHING LIQUID COMPOSITION IS PROV...

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Bibliographische Detailangaben
1. Verfasser: TAIKI YOSHINO
Format: Patent
Sprache:eng
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Zusammenfassung:A POLISHING LIQUID COMPOSITION THAT MAKES IT POSSIBLE TO PROVIDE A POLISHED SUBSTRATE SURFACE ON WHICH SCRATCHES AND/OR WAVINESS ARE REDUCED, WITHOUT IMPAIRING PRODUCTIVITY, IS PROVIDED, AND FURTHER, A METHOD FOR MANUFACTURING AND POLISHING A SUBSTRATE USING THIS POLISHING LIQUID COMPOSITION IS PROVIDED. THE POLISHING LIQUID COMPOSITION CONTAINS AN ABRASIVE, A WATER-SOLUBLE POLYMER, AND WATER, WHEREIN THE WATER-SOLUBLE POLYMER HAS A SULFONIC ACID GROUP, AND HAS AN AROMATIC RING IN EACH OF A MAIN CHAIN AND A SIDE CHAIN. THE METHOD FOR MANUFACTURING A SUBSTRATE, AND THE METHOD FOR POLISHING A SUBSTRATE, INCLUDE PERFORMING POLISHING BY SUPPLYING THE ABOVE-DESCRIBED POLISHING LIQUID COMPOSITION TO A SURFACE TO BE POLISHED OF A SUBSTRATE TO BE POLISHED, BRINGING A POLISHING PAD INTO CONTACT WITH THE SURFACE TO BE POLISHED, AND MOVING THE POLISHING PAD AND/OR THE SUBSTRATE TO BE POLISHED.